nSpecPRISM
The nSpec PRISM offers a complete solution for compound semiconductor front-end wafer manufacturing.
Photoluminescence inspection for front-end wafer manufacturing
Process agnostic
Gather valuable data points throughout production of compound semiconductors from unpolished substrates to epitaxy and device manufacturing.
Advanced illumination
The PRISM system incorporates a variety of illumination wavelengths to image a variety of materials and classify multiple defect types.
Speak with one of our product experts
Schedule a personalized demo and learn how Nanotronics can help your operations.
We have been using nSpec systems for the mapping of micropipes and dislocations in SiC wafers. It is a critical tool for our manufacturing process control and for the development of high quality SiC substrates.
Anonymous
Quality Manager
The ideal system for compound semiconductors
Flexible software
User-friendly software makes configuring recipes simple. As needs evolve, recipes are easily saved and modified.
Robust hardware
The nSpec PRISM can manage various sample form factors and uses Nanotronics' custom illuminator to inspect a wide range of materials.
Powered by Nanotronics AI
nTelligence is trained to identify early process defects before scaling to high-volume manufacturing.
Various lighting modalities
The illuminator enables operators to utilize existing imaging modalities while adding UV and IR Illumination to inspection processes.
Find device-killing defects.
System
Weight
363 kg
Dimensions (W x D x H)
236 cm x 157 cm x 194 cm
Min. Vacuum Requirement
-21 in. Hg (-70 kPa)
Power Supply
208—240 VAC, 15A, 50—60 Hz
Optics
Illumination Modes
Brightfield, Darkfield, Automated DIC (Nomarski), Ultraviolet Photoluminescence
Light Source
White light LED, Reflected UV LED (other options available)
Objectives
5x (included), 1.25x, 2x, 2.5x, 10x, 20x, 50x
Objective Turret
5‑position, User‑selectable
Stage
Travel, typical
200 mm X and Y directions
Positioning
Linear servo motors with closed‑loop encoders (50 nm resolution)
Repeatability
+/- 0.5 µm
Travel Flatness
30 µm
Centered Load Capacity
2.27 kg
Wafer Loader
Cassette
25 wafers / cassette, single Standard H‑Bar
Standard Wafer Sizes
50, 75, 100, 125, 150, and 200 mm
Wafer Alignment
Automatic by notch or flat
Options
Supported Protocols
SECS/GEM
Illumination
Transmitted light with automated polarizer
Filters
12‑position filter wheel
Enclosure
CleanCube (included)
Handling
OCR (frontside or backside), Ergonomic cassette loader, Sample specific fixtures
Machine learning
Offline workstation, nTelligence™
Automate inspection across your R&D and production lines
Automated Optical Inspection (AOI) is one of the most efficient forms of device inspection, but it is typically limited by resolution. Nanotronics AI detection algorithms overcome this and detect defects that would otherwise go unnoticed.
