Insights
Explained: The Inspection Process in Manufacturing
Substrate Wafers
Perform rapid, full-sample defect detection and classification on substrate wafers.
Benefits
Identify device-killing defects early
Detect and classify crystal defects in substrate wafers with cross-polarized transmitted light.
Maximize yield
Find device-killing defects in bare wafers prior to lithography and optimize future product layouts to maximize device yield.
Surface scattering analysis
Quickly analyze and measure subtle topographical features like surface roughness and haze.
Edge inspection
Detect bevel defects, as well as edge chips and cracks, with wafer inspection that scans to the edges.
Recommended Product
nSpecPS
The nSpec PS is highly flexible and detects defects in a variety of wafers, substrates, and materials.
System highlights
Max wafer size200 mm
Scan resolution0.9 µm/pixel (w/ 5x objective)
Industries
Our solutions are tailored to meet the unique challenges and demands of each sector.
Resources
More helpful resources from Nanotronics
Read More
Insights
Is Artificial Intelligence Cost-Effective? 16 Ways AI Helps Companies Save Money
Contact Us