Insights
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MEMS
Fully automated frontside and back-side inspection with edge exclusion handling.
Benefits
Automated sample flipping
Seamlessly handle and inspect samples with multiple sides.
Multiplane inspection
Automatically detect defects in multiple sample planes.
AI-powered defect classification
Quickly classify defects with nTelligence.
Device yield
Maximize device yield calculations with fully customizable parameters, such as region of interest and defect class.
Recommended Product
nSpecPS
The nSpec PS is highly flexible and detects defects in a variety of wafers, substrates, and materials.
System highlights
Max wafer size200 mm
Scan resolution0.9 µm/pixel (w/ 5x objective)
Industries
Our solutions are tailored to meet the unique challenges and demands of each sector.
Resources
More helpful resources from Nanotronics
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Insights
Identifying Where to Apply Machine Learning in Manufacturing
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