Advanced Packaging
Fully automated inspection throughout all steps of advanced packaging for wafer, panel, substrate or device level.
Comprehensive automated handling solutions
All-in-one tool
Automatically load wafers, quarter panels, full panels, and JEDEC trays in one tool.
AI-powered defect classification
Quickly classify defects with nTelligence.
nSpecPS
The nSpec PS is highly flexible and detects defects in a variety of wafers, substrates, and materials.
System highlights
Max wafer size200 mm
Scan resolution0.9 µm/pixel (w/ 5x objective)
Our solutions are tailored to meet the unique challenges and demands of each sector.
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