Insights
6 Key Steps in the Semiconductor Manufacturing Process
Advanced Packaging
Fully automated inspection throughout all steps of advanced packaging for wafer, panel, substrate or device level.
Benefits
Comprehensive automated handling solutions
All-in-one tool
Automatically load wafers, quarter panels, full panels, and JEDEC trays in one tool.
AI-powered defect classification
Quickly classify defects with nTelligence.
Recommended Product
nSpecPS
The nSpec PS is highly flexible and detects defects in a variety of wafers, substrates, and materials.
System highlights
Max wafer size200 mm
Scan resolution0.9 µm/pixel (w/ 5x objective)
Industries
Our solutions are tailored to meet the unique challenges and demands of each sector.
Resources
More helpful resources from Nanotronics
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Insights
New Applications of AI: How is Machine Learning Used in 7 Manufacturing Industries?
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