Gold

Bonding

Train a pipeline specific to your defects.

Advanced autofocus algorithms determine an autofocus map to deliver precise results across batches.

The nSpec LS can efficiently increase yields in the lab and scale processes.

ModularField upgradeable to automated system

Max wafer size300 mm

Scan resolution0.9 µm/pixel (w/ 5x objective)

Surface roughness
Determine surface roughness or haze to prevent non-uniform surfaces in subsequent processing steps.
Surface defects
Surface imperfections can affect the quality of subsequent layers deposited on the wafer.

Let’s talk about how Nanotronics can transform your manufacturing process.

Having trouble classifying critical defects? Nanotronics can help.