What is Wafer-Level Packaging, and What Forms Does it Take?

Combining computer vision, AI, optical microscopy and advanced robotics to inspect the world’s most sophisticated technologies.
Streamline R&D and improve lab processes for increased yields with precision manufacturing.
Automate inspection from R&D to production with a single tool
Ideal system for high-volume manufacturing environments. Robotic handling of wafers up to 300 mm or FOUPs to 650 mm.
Fully automated high‑volume manufacturing inspection with unprecedented speeds. Enhanced optics, illumination, and robotic motion deliver sub‑micron precision.
Complete solution for compound semiconductor frontend wafer manufacturing. Features UV and IR illumination for the most demanding inspection processes.
A hardware and software tool that will grow with your manufacturing needs
nSpec caters to a wide range of customers. Whether it's R&D, high‑volume manufacturing, semiconductors, healthcare or beyond, our systems offer confidence in consistent quality of output.
nSpec features various levels of automation to maximize production capacity, increase yield, and prevent manufacturing bottlenecks.
nTelligence is able to identify, classify, and assign causality to features of interest. Discover critical defects that otherwise go undetected by the human eye.
nSpec is configurable to meet a range of factory requirements, seamlessly adjusting for dynamic production environments.