Case Studies

Process Monitoring for Patterned Wafer Manufacturing

Defect map of patterned waferDefect map of patterned wafer

With nSpec, inspection becomes comprehensive throughout the lithography/patterned wafer manufacturing process.

nSpec Macro uses a golden template–based method to capture subtle defects where tolerance is very low, while limiting false positives in regions that have a higher level of variation or noise. Yield-loss data can help flag systematic issues.

Defect map captured by nSpec MacroDefect map captured by nSpec Macro
Defect map captured by nSpec Macro

Defect information associated with each die can be sent to back-end processing, and dies can be excluded in subsequent steps of manufacturing, reducing needless expenses.

nSpec can be strategically placed in each processing bay due to its low cost of ownership and small footprint, eliminating the need to move wafers to a central inspection bay.

Raw image of defect map captured by nSpec MacroRaw image of defect map captured by nSpec Macro

nSpec handles the most complex use cases ranging from numerous small devices within a single field of view to large devices comprised of multiple fields of view, as well as non-repeating devices or even/odd device patterns.

Contact Us

Get in touch with one of our industry experts.

Let's talk logistics.

Let’s talk about how Nanotronics can transform your manufacturing process.
Contact Us

Free sample report

Having trouble classifying critical defects? Nanotronics can help.
Get Sample Report